Quantitative Characterization of 96.5Sn3.5Ag and 80Au20Sn Optical Fiber Solder Bond Joints on Silicon Micro-Optical Bench Substrates.
| Autor: | Rassaian, Mostafa, Beranek, Mark W. |
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| Zdroj: | IEEE Transactions on Advanced Packaging. Feb99, Vol. 22 Issue 1, p86. 8p. 2 Black and White Photographs, 2 Diagrams, 3 Charts, 13 Graphs. |
| Databáze: | Business Source Ultimate |
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