Tradeoff Characteristics Between Resistivity and Reliability for Scaled-Down Cu-Based Interconnects.
| Autor: | Yokogawa, Shinji1 shinji.yokogawa@necel.com, Kikuta, Kuniko1, Tsuchiya, Hideaki1, Takewaki, Toshiyuki1, Suzuki, Mieko1, Toyoshima, Hironori1, Kakuhara, Yumi1, Kawahara, Naoyoshi1, Usami, Tatsuya2, Ohto, Koichi2, Fujii, Kunihiro2, Tsuchiya, Yasuaki2, Arita, Koji2, Motoyama, Koichi2, Tohara, Makoto2, Taiji, Toshiji2, Kurokawa, Tetsuya3, Sekine, Makoto2 |
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| Zdroj: | IEEE Transactions on Electron Devices. Jan2008, Vol. 55 Issue 1, p350-357. 8p. |
| Databáze: | Business Source Ultimate |
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