Solder Joint Fatigue in a Surface Mount Assembly Subjected to Mechanical Loading.
Autor: | Tamin, Mohd N.1 taminmn@fkm.utm.my, Yek Ban Liew1 yekban@yahoo.com, Wagiman, Amir N. R.2 amir.nur.rashid.wagiman@intel.com, Loh, W. K.2 wei.keat.loh@intel.com |
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Zdroj: | IEEE Transactions on Components & Packaging Technologies. Dec2007, Vol. 30 Issue 4, p824-829. 6p. 3 Diagrams, 3 Charts, 3 Graphs. |
Databáze: | Business Source Ultimate |
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