Interfacial Degradation Mechanism of Au/A1 and Alloy/A1 Bonds Under High Temperature Storage Test: Contamination, Epoxy Molding Compound, Wire and Bonding Strength.

Autor:	Jongwoo Park1 jongwoo.s.park@samsung.com, Hyun-Joon Cha1, Back-Sung Kim1, Yong-Bum Jo1, June-Kyun Park1, Sam-Young Kim1, Sang-Cheol Shin1, Man-Young Shin1, Kyung-Il Ouh1, Hyungoo Jeon1
Zdroj:	IEEE Transactions on Components & Packaging Technologies. Dec2007, Vol. 30 Issue 4, p731-744. 14p. 5 Black and White Photographs, 1 Diagram, 4 Charts, 9 Graphs.
Databáze:	Business Source Ultimate
Externí odkaz:	Zobrazit plný text záznamu