Integrating High-k Ceramic Thin Film Capacitors into Organic Substrates Via Low-Cost Solution Processing.

Autor: Raj, P. Markondeya1 raj@ece.gatech.edu, Balaraman, Devarajan2, Abothu, Isaac Robin1, Chong Yoon1, Nam-Kee Kang3, Tummala, Rao1
Zdroj: IEEE Transactions on Components & Packaging Technologies. Dec2007, Vol. 30 Issue 4, p585-594. 10p. 4 Black and White Photographs, 2 Charts, 9 Graphs.
Databáze: Business Source Ultimate