COPPER VIA FILL -- Solution for HDI Via-in-Pad.
| Autor: | Shea, Chrys1 ChrysShea@cooksonelectronics.com, Ormerod, David2 dormerod@cooksonelectronics.com |
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| Zdroj: | Printed Circuit Design & Manufacture. Oct2007, Vol. 24 Issue 10, p24-30. 5p. |
| Databáze: | Business Source Ultimate |
| Externí odkaz: |
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