Data mining for improving the solder bumping process in the semiconductor packaging industry.
| Autor: | Chien, Chen-fu1 cfchien@mx.nthu.edu.tw, Li, Huan-chung1,2, Jeang, Angus2 |
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| Zdroj: | Intelligent Systems in Accounting, Finance & Management. Jan2006, Vol. 14 Issue 1/2, p43-57. 15p. 3 Diagrams, 5 Charts, 2 Graphs. |
| Databáze: | Business Source Ultimate |
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