A Study of Process-Induced Deformations of Anisotropic Conductive Film (ACF) Assembly.
| Autor: | Hsien-Chie Cheng1 hccheng@fcu.edu.tw, Cheng-Lin Ho2, Wen-Chih Chen3, Sheng-Shu Yang4 |
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| Zdroj: | IEEE Transactions on Components & Packaging Technologies. Sep2006, Vol. 29 Issue 3, p577-588. 12p. 4 Black and White Photographs, 5 Charts, 12 Graphs. |
| Databáze: | Business Source Ultimate |
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