Using Underfill to Enhance Lead-free Drop Test Reliability.

Autor: Maslyk, Dan dan.maslyk@us.henkel.com, Privett, Mark mark.privett@us.henkel.com, Toleno, Brian brian.toleno@us.henkel.com
Zdroj: SMT: Surface Mount Technology. May2006, Vol. 20 Issue 5, p20-23. 4p.
Databáze: Business Source Ultimate