Using Underfill to Enhance Lead-free Drop Test Reliability.
Autor: | Maslyk, Dan dan.maslyk@us.henkel.com, Privett, Mark mark.privett@us.henkel.com, Toleno, Brian brian.toleno@us.henkel.com |
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Zdroj: | SMT: Surface Mount Technology. May2006, Vol. 20 Issue 5, p20-23. 4p. |
Databáze: | Business Source Ultimate |
Externí odkaz: |