Achieving Ceramic Properties for Embedding Components in Organic Substrates.
| Autor: | Raj, P. Markondeya1 raj@ece.gatech.edu, Balaraman, Devarajan1 dev@ece.gatech.edu, Abothu, Isaac Robin1 robin@ece.gatech.edu, Tummala, Rao1 rtummala@ece.gatech.edu |
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| Zdroj: | Advanced Packaging. Mar2006, Vol. 15 Issue 3, p20-20. 1p. |
| Databáze: | Business Source Ultimate |
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