Study on the Effects of Wafer Thinning and Dicing on Chip Strength.
| Autor: | Shoulung Chen1, Tsai, C. Z.2, Wu, Enboa3 ebwu@iam.ntu.edu.tw, Shih, I. G.3, Chen, Y. N.3 |
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| Zdroj: | IEEE Transactions on Advanced Packaging. Feb2006, Vol. 29 Issue 1, p149-157. 9p. |
| Databáze: | Business Source Ultimate |
| Externí odkaz: |
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