Process and Design Tradeoffs Between Minimum RC Signal Propagation Delay and Interconnect Current Density and Resistance for Deep Submicrometer ICs.
| Autor: | Inohara, Masahiro1 masahiro.inohara@toshiba.co.jp, Toyoshima, Yoshiaki1 |
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| Zdroj: | IEEE Transactions on Electron Devices. Dec2005, Vol. 52 Issue 12, p2634-2639. 6p. |
| Databáze: | Business Source Ultimate |
| Externí odkaz: |
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