Effect of the solder conductive particles and substrate widths on the current carrying capability for flex-on-board (FOB) assembly.
| Autor: | Pan, Yan1 (AUTHOR) yan.pan@siat.ac.cn, Zhang, Shuye2 (AUTHOR) syzhang@hit.edu.cn, Zhu, Pengli1 (AUTHOR) pl.zhu@siat.ac.cn, Paik, Kyung W.3 (AUTHOR) kwpaik@kaist.ac.kr |
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| Zdroj: | Soldering & Surface Mount Technology. 2024, Vol. 36 Issue 5, p253-259. 7p. |
| Databáze: | Business Source Ultimate |
| Externí odkaz: |
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