Interfacial IMC growth behavior of Sn-3Ag-3Sb-xIn solder on Cu substrate.
| Autor: | Zhou, Jiacheng1 (AUTHOR) zhoujc1228@163.com, Shi, Jinglin2 (AUTHOR) shijinglin321@126.com, Xu, Lei2 (AUTHOR) xulei@composolder.com, Zhang, Fuwen2 (AUTHOR) zhangfuwen@aliyun.com, Wang, Zhigang2 (AUTHOR) wangzhigang@composolder.com, Hu, Qiang3 (AUTHOR) hqgrinm@163.com, He, Huijun3 (AUTHOR) hehj2000@vip.sina.com |
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| Zdroj: | Soldering & Surface Mount Technology. 2024, Vol. 36 Issue 5, p276-284. 9p. |
| Databáze: | Business Source Ultimate |
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