DSH to Extend-DSH: Chip-Level Chemical Mechanical Planarization (CMP) Model Upgrade Based on Decoupling Regression Strategy.

Autor: Yue, Qian1 (AUTHOR) qianyue@ime.ac.cn, Lan, Chen1 (AUTHOR) chenlan@ime.ac.cn
Zdroj: IEEE Transactions on Semiconductor Manufacturing. Aug2024, Vol. 37 Issue 3, p329-339. 11p.
Databáze: Business Source Ultimate