Minimization of Particle Deposition on Wafers Caused by the Pressure Change in the Vacuum Chamber Through a Pressure Control Regulation Process.
| Autor: | Ku, Ching-Ming1 (AUTHOR) jimmy.ku.c@nycu.edu.tw, Yea Jang, Wen1 (AUTHOR) wyjang@nycu.edu.tw, Cheng, Stone1 (AUTHOR) chengstone@nycu.edu.tw |
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| Zdroj: | IEEE Transactions on Semiconductor Manufacturing. Aug2024, Vol. 37 Issue 3, p340-344. 5p. |
| Databáze: | Business Source Ultimate |
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