Self-driven manifold microchannel heat sink for cooling electronics.

Autor:	Shen, Yi-Tao1 (AUTHOR), Pan, Yu-Hui1 (AUTHOR), Hao, Jian-Min1 (AUTHOR), Zhou, Rui1 (AUTHOR), Yang, Yin-Fa1 (AUTHOR), Chen, Hua1 (AUTHOR) huami@ustc.edu.cn, Cheng, Wen-Long1 (AUTHOR) wlcheng@ustc.edu.cn
Zdroj:	Applied Thermal Engineering. Jul2024, Vol. 249, pN.PAG-N.PAG. 1p.
Databáze:	Business Source Ultimate
Externí odkaz:	Zobrazit plný text záznamu Full Text from ScienceDirect