Performance Comparison of Contemporary Stencil Coatings and Underwipe Solvents on 0.4mm BGA Packages: Should chemistry formulation and drying time factor into solvent selection?
| Autor: | SHEA, CHRYS1 chrys@sheaengineering.com, CARBONI, DEBBIE2 debbie_carboni@kyzen.com, HANERHOFF, JOHN3 |
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| Zdroj: | Printed Circuit Design & Fab: Circuits Assembly. May2024, Vol. 41 Issue 5, p59-75. 17p. |
| Databáze: | Business Source Ultimate |
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