Wafer-to-Wafer Bonding Fabrication Process-Induced Wafer Warpage.
| Autor: | Feng, Wei1 (AUTHOR) wei.feng@aist.go.jp, Shimamoto, Haruo1 (AUTHOR) haruo.shimamoto@aist.go.jp, Kawagoe, Tsuyoshi2 (AUTHOR) t.kawagoe@ultramemory.co.jp, Honma, Ichirou2 (AUTHOR) i.homma@ultramemory.co.jp, Yamasaki, Masato2 (AUTHOR) m.yamasaki@ultramemory.co.jp, Okutsu, Fumitake2 (AUTHOR) f.okutsu@ultramemory.co.jp, Masuda, Takatoshi2 (AUTHOR) t.masuda@ultramemory.co.jp, Kikuchi, Katsuya1 (AUTHOR) k-kikuchi@aist.go.jp |
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| Zdroj: | IEEE Transactions on Semiconductor Manufacturing. Aug2023, Vol. 36 Issue 3, p398-403. 6p. |
| Databáze: | Business Source Ultimate |
| Externí odkaz: |
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