Effect of Parameters of Chemical Mechanical Polishing (CMP) for Improving Surface Roughness for Semiconductor Material Kind Silicon.
| Autor: | Mousa, Shakir M.1 inm.shr@atu.edu.iq, Aghdeab, Shukry H.2 |
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| Zdroj: | Instrumentation, Mesures, Métrologies. Jun2023, Vol. 22 Issue 3, p121-125. 5p. |
| Databáze: | Business Source Ultimate |
| Externí odkaz: |
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