A Zagging and Weaving Model for Dislocation Interactions in Heterostructures Containing Strain Reversals.

Autor: Kujofsa, Tedi1 (AUTHOR) tedi.kujofsa@gmail.com, Ayers, J. E.1 (AUTHOR) john.ayers@uconn.edu
Zdroj: International Journal of High Speed Electronics & Systems. Mar-Dec2020, Vol. 29 Issue 1-4, pN.PAG-N.PAG. 5p.
Databáze: Business Source Ultimate