Hardness Characteristics of Au Cone-Shaped Bumps Targeted for 3-D Packaging Applications.
| Autor: | Ying Ying Lim1 y-lim@edu.k.u-tokyo.ac.jp, Hiroshi Nakagawa1, Masaru Hashino1, Masahiro Aoyagi1, Katsuya Kikuchi1 k-kikuchi@aist.go.jp |
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| Zdroj: | IEEE Transactions on Components, Packaging & Manufacturing Technology. Mar2019, Vol. 9 Issue 3, p419-426. 8p. |
| Databáze: | Business Source Ultimate |
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