Advanced Mechanical/Optical Configuration of Real-Time Moiré Interferometry for Thermal Deformation Analysis of Fan-Out Wafer Level Package.
| Autor: | Wu, Bulong1, Han, Bongtae1 |
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| Zdroj: | IEEE Transactions on Components, Packaging & Manufacturing Technology. May2018, Vol. 8 Issue 5, p764-772. 9p. |
| Databáze: | Business Source Ultimate |
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