Comparisons of Conventional, 3-D, Optical, and RF Interconnects for On-Chip Clock Distribution.
| Autor: | Kuan-Neng Chen, Jeffrey1 knchen@mit.edu, Kobrinsky, Mauro J.2, Barnett, Brandon C.2, Reif, Rafael2 |
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| Zdroj: | IEEE Transactions on Electron Devices. Feb2004, Vol. 51 Issue 2, p233-239. 7p. |
| Databáze: | Business Source Ultimate |
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