Sensitive Strain Measurement of Bonded SOI Films Using Moiré.

Autor: Meinhold, Mitchell W.1 mitmitch@alum.mit.edu, Jong-Wan Jung, Mitchell W.2 jjwkss@mtl.mit.edu, Antoniadis, Dimitri A.2 daa@mtl.mit.edu
Zdroj: IEEE Transactions on Semiconductor Manufacturing. Feb2004, Vol. 17 Issue 1, p35-41. 7p.
Databáze: Business Source Ultimate