Sensitive Strain Measurement of Bonded SOI Films Using Moiré.
Autor: | Meinhold, Mitchell W.1 mitmitch@alum.mit.edu, Jong-Wan Jung, Mitchell W.2 jjwkss@mtl.mit.edu, Antoniadis, Dimitri A.2 daa@mtl.mit.edu |
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Zdroj: | IEEE Transactions on Semiconductor Manufacturing. Feb2004, Vol. 17 Issue 1, p35-41. 7p. |
Databáze: | Business Source Ultimate |
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