Ablation and cutting of planar silicon devices using femtosecond laser pulses.
| Autor: | Bärsch, N., Körber, K., Ostendorf, A., Tönshoff, K.H. |
|---|---|
| Zdroj: | Applied Physics A: Materials Science & Processing. 2003, Vol. 77 Issue 2, p237. 6p. |
| Databáze: | Academic Search Ultimate |
| Externí odkaz: |
|