Integrated Circuit Super-Resolution Failure Analysis with Solid Immersion Lenses.

Autor: Vigil, Kyle1 klvigil@bu.edu, Yang Lu2, Yurt, Abdulkadir3, Cilingiroglu, Tenzile Berkin4, Bifano, Thomas G.2, Ünlü, M. Selim1,4, Goldberg, Bennett B.1,4
Zdroj: Electronic Device Failure Analysis. May2014, Vol. 16 Issue 2, p26-32. 7p.
Databáze: Academic Search Ultimate