MEMS packaging, assembly, and test for the marketplace.

Autor:	APANIUS, MATT1, GRACE, ROGER H.2, SPANGLE, LELAND "CHIP"3
Zdroj:	Electronic Products. Jul2013, Vol. 56 Issue 2, p42-44. 3p.
Databáze:	Academic Search Ultimate
Externí odkaz:	Zobrazit plný text záznamu