THIN-FILM THERMAL CONDUCTIVITY AND THICKNESS MEASUREMENTS USING PICOSECOND ULTRASONICS.

Autor:	Hostetler, J. L., Smith, A. N., Norris, P. M.
Zdroj:	Microscale Thermophysical Engineering. Jul1997, Vol. 1 Issue 3, p237-244. 8p.
Databáze:	Academic Search Ultimate
Externí odkaz:	Zobrazit plný text záznamu