ZERO THICKNESS DIFFUSION BARRIERS AND METALLIZATION LINERS FOR NANOSCALE DEVICE APPLICATIONS.

Autor: Kaloyeros, AlainE.1 (AUTHOR) akaloyeros@uamail.albany.edu, Eisenbraun, EricT.1 (AUTHOR), Dunn, Kathleen1 (AUTHOR), van der Straten, Oscar2 (AUTHOR)
Zdroj: Chemical Engineering Communications. Nov2011, Vol. 198 Issue 11, p1453-1481. 29p. 6 Diagrams, 3 Charts.
Databáze: Academic Search Ultimate
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