Integrating copper at the nanometer length scale with Sn-3⋅5Ag solder to develop high performance nanocomposites.
| Autor: | Babaghorbani, P.1, Nai, S. M. L.2, Gupta, M.1 |
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| Zdroj: | Materials Science & Technology. Oct2009, Vol. 25 Issue 10, p1258-1264. 7p. 5 Diagrams, 2 Charts, 3 Graphs. |
| Databáze: | Academic Search Ultimate |
| Externí odkaz: |
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