A technique for characterizing surface recombination in silicon wafers based on thermal-emission measurements.

Autor: Bogatyrenko, V. V.1 bogatyrenko@isp.kiev.ua
Zdroj: Semiconductors. Mar2010, Vol. 44 Issue 3, p392-395. 4p. 1 Diagram, 2 Graphs.
Databáze: Academic Search Ultimate