A technique for characterizing surface recombination in silicon wafers based on thermal-emission measurements.
Autor: | Bogatyrenko, V. V.1 bogatyrenko@isp.kiev.ua |
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Zdroj: | Semiconductors. Mar2010, Vol. 44 Issue 3, p392-395. 4p. 1 Diagram, 2 Graphs. |
Databáze: | Academic Search Ultimate |
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