INDENTATION SIZE EFFECT ON THE CREEP BEHAVIOR OF A SnAgCu SOLDER.
| Autor: | HAN, Y. D.1,2, JING, H. Y.1, NAI, S. M. L.3, XU, L. Y.1, TAN, C. M.2,3, WEI, J.3 jwei@SIMTech.a-star.edu.sg |
|---|---|
| Zdroj: | International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics. 1/20/2010, Vol. 24 Issue 1/2, p267-275. 9p. 1 Diagram, 6 Graphs. |
| Databáze: | Academic Search Ultimate |
| Externí odkaz: |
|