Thermo-Mechanical Challenges in Stacked Packaging.

Autor: Agonafer, Dereje1 (AUTHOR) agonafer@uta.edu, Kaisare, Abhijit2 (AUTHOR), Hossain, MohammadM.3 (AUTHOR), Lee, Yongje4 (AUTHOR), Dewan-Sandur, BhavaniP.2 (AUTHOR), Dishongh, Terry3 (AUTHOR), Pekin, Senol3 (AUTHOR)
Zdroj: Heat Transfer Engineering. Feb2008, Vol. 29 Issue 2, p134-148. 15p. 5 Black and White Photographs, 9 Diagrams, 9 Charts, 8 Graphs.
Databáze: Academic Search Ultimate
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