Electrochemical co-deposition of ternary Sn–Bi–Cu films for solder bumping applications.
| Autor: | Joseph, Shany1, Phatak, Girish J.1 gjp@cmet.gov.in, Gurunathan, K.1, Seth, Tanay1, Amalnerkar, D. P.1, Kutty, T. R. N.2 |
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| Zdroj: | Journal of Applied Electrochemistry. Aug2006, Vol. 36 Issue 8, p907-912. 6p. 3 Black and White Photographs, 3 Charts, 3 Graphs. |
| Databáze: | Academic Search Ultimate |
| Externí odkaz: |
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