High-speed electrical testing of multichip ceramic modules.
| Autor: | Manzer, D. G.1 manzer@us.ibm.com, Karidis, J. P.1 karidis@us.ibm.com, Wiley, K. M.2 kmwiley@us.ibm.com, Bruen, D. C.2 bruen@us.ibm.com, Cline, C. W.2 cline@us.ibm.com, Hendricks, C.2 chendric@us.ibm.com, Wiggin, R. N.2 Robert_N_Wiggin@us.ibm.com, Yu, Y.-Y.3 yuy@us.ibm.com |
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| Zdroj: | IBM Journal of Research & Development. Jul/Aug2005, Vol. 49 Issue 4/5, p687-697. 11p. |
| Databáze: | Academic Search Ultimate |
| Externí odkaz: |
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