Approaches to diffusion barrier creation and trench filling for copper interconnection formation.
| Autor: | Gromov, D. G.1 pcfme@dpts.miee.ru, Mochalov, A. I.1, Klimovitskiy, A. G.1, Sulimin, A. D.1, Redichev, E. N.1 |
|---|---|
| Zdroj: | Applied Physics A: Materials Science & Processing. Nov2005, Vol. 81 Issue 7, p1337-1343. 7p. |
| Databáze: | Academic Search Ultimate |
| Externí odkaz: |
|