Simulation modeling of wafer grinding surface roughness considering grinding vibration.
| Autor: | Li, Meng1 (AUTHOR) LM2022@mail.dlut.edu.cn, Zhu, Xianglong1 (AUTHOR) zhuxianglong@dlut.edu.cn, Kang, Renke1 (AUTHOR), Li, Jiasheng1 (AUTHOR), Xu, Jiahui1 (AUTHOR), Li, Tianyu1 (AUTHOR) |
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| Zdroj: | Precision Engineering. Dec2024, Vol. 91, p278-289. 12p. |
| Databáze: | Academic Search Ultimate |
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