Transformation of hexagonal boron nitride nanocomposite underfill in microelectronics packaging.

Autor: Razgaleh, S. A.1,2,3 (AUTHOR), Aravamudhan, Shyam1 (AUTHOR) saravamu@ncat.edu
Zdroj: Polymer Composites. 10/10/2024, Vol. 45 Issue 14, p12575-12586. 12p.
Databáze: Academic Search Ultimate
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