Modelling and simulation for the investigation on the ultrasonic propagation mechanism in advanced microelectronic packages.
| Autor: | Yuan Chen1,2 chenyuan1030@126.com, Dengxue Liu2, Yuhui Fan2, Zhongyang Wang2, Xiang Wan2,3, Ming Dong2,3 |
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| Zdroj: | Insight: Non-Destructive Testing & Condition Monitoring. Jul2024, Vol. 66 Issue 7, p415-423. 9p. |
| Databáze: | Academic Search Ultimate |
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