ASSESSING COMPATIBILITY OF ADVANCED IC PACKAGES TO X-RAY BASED PHYSICAL INSPECTION.
| Autor: | M. Khan, M. Shafkat1 m.khan3@ufl.edu, Chengjie Xi1, Varshney, Nitin1, Khan, Aslam A.1, Dalir, Hamed1, Asadizanjani, Navid |
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| Zdroj: | Electronic Device Failure Analysis. Aug2024, Vol. 26 Issue 3, p14-24. 11p. |
| Databáze: | Academic Search Ultimate |
| Externí odkaz: |
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