Liquid Metal‐Based High‐Density Interconnect Technology for Stretchable Printed Circuits.

Autor: Wang, Bei1,2 (AUTHOR), Prasad, Sonal3 (AUTHOR), Hellman, Oskar2 (AUTHOR), Li, Hao4 (AUTHOR), Fridberger, Anders3 (AUTHOR), Hjort, Klas2 (AUTHOR) klas.hjort@angstrom.uu.se
Zdroj: Advanced Functional Materials. Aug2024, Vol. 34 Issue 31, p1-12. 12p.
Databáze: Academic Search Ultimate
Externí odkaz: