Neural Network-based Fast and Intelligent Signal Integrity Assessment Model for Emerging MWCNT Bundle On-Chip Interconnects in Integrated Circuit.
| Autor: | Bhatti, Gulafsha1 (AUTHOR) 202021005@daiict.ac.in, Pathade, Takshashila1 (AUTHOR) takshu.chunarkar@gmail.com, Agrawal, Yash1 (AUTHOR) mr.yashagrawal@gmail.com, Palaparthy, Vinay1 (AUTHOR) vinay_shrinivas@daiict.ac.in, Gohel, Bakul1 (AUTHOR) bakul_gohel@daiict.ac.in, Parekh, Rutu1 (AUTHOR) rutu_parekh@daiict.ac.in, Girish Kumar, Mekala2 (AUTHOR) giri.frds@gmail.com |
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| Zdroj: | IETE Journal of Research. Mar2024, Vol. 70 Issue 3, p2878-2893. 16p. |
| Databáze: | Academic Search Ultimate |
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