Experimental and Numerical Investigation of Delamination Between Epoxy Molding Compound (EMC) and Metal in Encapsulated Microelectronic Packages.
| Autor: | Shih, M.-K.1 (AUTHOR) mkshih@nfu.edu.tw, Liu, Y.-H.1 (AUTHOR), Lin, G.-S.1 (AUTHOR), Hsu, E.2 (AUTHOR), Yang, J.2 (AUTHOR) |
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| Zdroj: | Experimental Techniques. Aug2024, Vol. 48 Issue 4, p599-609. 11p. |
| Databáze: | Academic Search Ultimate |
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