A NON-DESTRUCTIVE EVALUATION OF MICROSTRUCTURAL ANALYSIS IN SN-AG-CU SOLDER JOINT BY SYNCHROTRON X-RAY RADIATION TOMOGRAPHY.
Autor: | TAN, C. Y.1 chiying95@outlook.com, SALLEH, M. A. A. MOHD1, SAUD, N.1, NABIALEK, M.2, RYLSKI, A.3 |
---|---|
Zdroj: | Archives of Metallurgy & Materials. 2024, Vol. 69 Issue 2, p661-665. 5p. |
Databáze: | Academic Search Ultimate |
Externí odkaz: |