Exploration of Interfacial Materials Chemistry Control to Improve Cu Wire-Bonding Reliability.
| Autor: | Durai, Kevin Antony Jesu1, Kumaravel, Dinesh Kumar1, Alptekin, John1, Estridge, Logan1, Nair, Shyam1, Chyan, Oliver1 |
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| Zdroj: | Journal of Microelectronic & Electronic Packaging. 2024, Vol. 21 Issue 2, p42-49. 8p. |
| Databáze: | Academic Search Ultimate |
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