Effect of Ag3Sn Nanopariicles on the Morphology and Thickness of Solder Intermetaliic Compounds.
| Autor: | LI Xiu1, YAN Jikang1, WANG Biao1, XU Jiayi1, RONG Lin1, LI Aike1, YANG Haoming1 |
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| Zdroj: | Nonferrous Metals Engineering. Jun2024, Vol. 14 Issue 6, p26-36. 11p. |
| Databáze: | Academic Search Ultimate |
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