Enhanced Copper Bonding Interfaces by Quenching to Form Wrinkled Surfaces.

Autor:	Lu, Tsan-Feng1 (AUTHOR) s0881513.c@nycu.edu.tw, Yen, Yu-Ting1 (AUTHOR), Wang, Pei-Wen1 (AUTHOR), Cheng, Yuan-Fu1 (AUTHOR), Chen, Cheng-Hsiang1 (AUTHOR), Wu, YewChung Sermon1 (AUTHOR) sermonwu@stanfordalumni.org
Zdroj:	Nanomaterials (2079-4991). May2024, Vol. 14 Issue 10, p861. 8p.
Databáze:	Academic Search Ultimate
Externí odkaz:	Zobrazit plný text záznamu