Investigating a Machine Learning Approach to Predicting White Pixel Defects in Wafers—A Case Study of Wafer Fabrication Plant F.

Autor: Shih, Dong-Her1 (AUTHOR) shihdh@yuntech.edu.tw, Yang, Cheng-Yu2 (AUTHOR) roy@fstech.com.tw, Wu, Ting-Wei1 (AUTHOR) wutingw@yuntech.edu.tw, Shih, Ming-Hung3 (AUTHOR) mshih@iastate.edu
Zdroj: Sensors (14248220). May2024, Vol. 24 Issue 10, p3144. 26p.
Databáze: Academic Search Ultimate
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