Thermal Characteristic Investigation for a Multichip Module Based on APDL.
| Autor: | Qian Lin1, Peng-Fei Zhao1, Rui-lan Yang2, Hai-feng Wu2 abgott@126.com |
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| Zdroj: | International Journal of RF & Microwave Computer-Aided Engineering. 4/17/2024, Vol. 2024, p1-11. 11p. |
| Databáze: | Academic Search Ultimate |
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